If it’s for a digital or power-electronics design, you might want to bypass that question entirely and put in a plane/copper pour/copper fill (all synonyms) that encompasses all these pads.

This helps with power dissipation and lowers resistance though has parasitic inductance and capacitance ramifications. It depends on what goes through that net !

On the other hand if this is analog, high frequency, rf or mixed-signal, I would suggest looking at what kind of requirements you have for that net mathematically. You can find the parasitic inductance and capacitance equations (approximations) online quite easily.

I know of no PCB fab house that prices production on how much copper is etched out of the foil (even though they recycle the dissolved copper afterwards). On the contrary, i usually got the advice of leaving as much copper on the board as I could, as it makes their life easier (and balancing becomes very easy).